European Microwave Integrated Circuits Conference 2019

29th September – 2nd October 2019 

 

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The 14th European Microwave Integrated Circuits Conference (EuMIC) will be held in Paris, France, as part of the European Microwave Week 2019. Initiated by the GAAS® Association in 1990 and renamed in 2006, the conference returns to Paris in 2019.

The EuMIC conference is jointly organised by the GAAS® Association and EuMA and is the premier European technical conference for RF, microwave and photoelectronic. It has established itself as a key contributor to the success of the overall European Microwave Week and remains the largest scientific event in Europe related to microwave integrated circuits.

The aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications; encompassing all relevant aspects such as theory, simulation, design, and measurement. Research and innovation in this field helps to create the crucial enabling infrastructure for new and emerging information and communication applications, such as 5G communications, the Internet-of-Things or sustainable electronics.

Technological innovations continue to drive challenges for modelling and simulation as well as for the characterization techniques applied at both device and circuit levels. While GaAs and silicon-based IC technologies are extensively used in today’s systems, wide-bandgap (SiC, GaN, etc.) are taking an ever increasing share in new systems and emerging technologies such as CNT and graphene-based devices are expected to become commercially available within the coming years, with a huge expected impact on system performance. Moreover, new materials and devices push integrated circuit capability to millimetre-wave and even to THz bands, while high-speed digital and optoelectronic integrated circuits represent other key areas of interest.

In the modelling area, topics related to device and system small- and large-signal characterisation, test set-ups, and modelling approaches up to the THz band are of interest. In the technology area, papers on nanotechnologies for microwaves, as well as wide-bandgap devices and technologies for microwave photonics are specifically solicited. Topics related to semiconductor devices, IC reliability and 3D-interconnects in ICs are also invited to the conference. Finally, contributions are encouraged in the areas of circuit design and applications, RF and microwave ICs, millimetre and sub-millimetre wave ICs, photonic ICs, mixed-signal and high-speed digital ICs, tunable and reconfi gurable ICs as well as integrated detectors, receivers, transmitters, and transceivers.

If you are interested in the subject of microwave and RF microelectronic devices and ICs, the EuMIC conference is an exceptional high-quality event to learn about the latest advances in the field and to meet internationally recognized experts from both industry and academia.

Conference Topics

Characterization, Modelling and Circuit Simulation

G01 Physics-based and Multi-physics Device Modelling and Simulation: Physical device and structure modelling to active linear and non-linear simulation, characterization, parameter extraction and model validation techniques. Design optimization techniques for simulation
G02 TCAD Device Modelling and Simulation: Circuit- and statistics-based modelling including but not limited to analysis and design optimization, surrogate modelling and model-order reduction techniques
G03 Small Signal, Large Signal and Noise Modelling and Characterization: Empirical and behavioural device and structure modelling including but not limited to active and passive, linear and non-linear characterization, parameter extraction, and model validation techniques
G04 Linear and Non-linear CAD Techniques for Devices and Circuits: Computer-aided design including but not limited to design automation, finite-difference, finite-element, integral equation, hybrid and other simulation methods for RF, microwave and terahertz devices and circuits, distortion, stability and qualitative dynamics analysis
G05 Modelling of Passive RF, Microwave, mm-Wave and Photonic Components for ICs: Physical and electrical equivalent modelling of passive high frequency and photonic components, integrated guided-wave structures, transducers and interconnects
G06 Advanced Packaging and Thermal Simulation of High Power Devices and ICs: High power, electronic packaging thermal management, heat dissipation, electrothermal effects, semiconductor device packaging

Technologies and Devices

G07 Nanotechnologies, Nanodevices and Nanomaterials for Microwaves: New and emerging material and device concepts including but not limited to carbon nanotubes, nanowires, nanoparticles, other nano-object based devices and systems, 1D-2D material-based electronics, metamaterials, graphene, diamond, organic carbon-based devices and technologies
G08 III-V Compound Semiconductor Devices and IC Technologies: Monolithic integrated electronic devices based on III-V compound semiconductor technologies including but not limited to RF, microwave, and millimetre wave active and passive devices in GaAs, InP and other compound semiconductors
G09 Wide-Bandgap Semiconductor Devices and IC Technologies: Monolithic integrated electronic devices based on wide-bandgap-based semiconductors including but not limited to RF, microwave, and millimetre-wave active and passive devices in GaN, SiC, diamond and others
G10 Si-based Semiconductor Devices and IC Technologies: Monolithic integrated electronic devices based on Si-based semiconductor technologies including but not limited to RF, microwave, and millimetre-wave active and passive devices in Si (C)MOS, SiGe BiCMOS and others
G11 Device and IC Reliability, Manufacturing Processes and Testing: MMIC technologies and processes including but not limited to manufacturing, reliability, failure analysis, testing, yield and cost
G12 3D-Interconnects in ICs: 3D-interconnects, wafer level stacking and bonding, interconnect between heterogeneous materials, and technologies with integrated cooling. Planar and non-planar integrated transmission lines, waveguides, couplers, dividers/combiners, tuneable devices
G13 Devices for Integrated Microwave Photonics: Novel electronic, photonic and opto-electronic devices for millimetre wave and Terahertz operation including but not limited to tunnel-FETs, resonant tunnelling diodes, unitraveling carrier photo diodes, mixers and other nonlinear photonic devices, and Silicon Photonics
G14 New and Emerging Material and Device Concepts (Metamaterials, Graphene, Carbon Nanotubes, Organic, etc.): New and emerging material and device concepts other than those included in previous sections

Circuit Design and Applications

G15 RF and Microwave Integrated Circuits: Linear and nonlinear MMICs with upper cut-off frequencies up to 30 GHz including but not limited to signal amplifi cation, generation, modulation, frequency conversion, phase and amplitude control
G16 Millimetre-Wave and Sub-Millimetre-Wave Integrated Circuits: Linear and non-linear MMICs with upper cutoff frequencies beyond 30 GHz including but not limited to signal amplifi cation, generation, modulation, frequency conversion, phase and amplitude control
G17 Low Noise Circuits and Modules (*): Low noise amplifiers, filters, mixers, sources and other circuits and modules such as detectors, receivers, radiometers
G18 Integrated Solid State Power Amplifiers: Monolithically integrated power amplifiers for RF, microwave, and millimetre-wave signals including but not limited to wide bandgap, compound semiconductor and silicon-based microwave power amplifiers; switch-mode amplifiers
G19 Power Amplifiers: Efficiency Enhancement and Linearization (*): Cartesian and polar power amplifier design, behavioural modelling, continuous and switch mode operation, linearization and predistortion techniques, effi ciency enhancement, adaptive gain control, power combining, matching and packaging, amplitude and phase characterization
G20 Si-Based, Mixed Signal, High Speed Digital ICs: Integrated circuit modelling, Mixed analogue-digital integrated circuits. High speed integrated circuits. InP and Si-based circuits
G21 Power Silicon Devices: Semiconductor materials, Silicon compounds, power electronics, power semiconductors diodes and transistors
G22 Ultra Low-Power Integrated Circuits: Intelligent sensors, low-power electronics. Energy consumption
G23 Tunable and Reconfigurable Circuits and Systems (*): Electric, magnetic, mechanic and thermal tuning approaches, switches and switching devices, tuneable, reconfi gurable or programmable devices, performance metrics and evaluation
G24 Integrated Receivers, Transmitters and Transceivers: Monolithic integrated transceiver circuits including but not limited to homodyne, heterodyne, direct-detection, coherent and incoherent receivers, detectors and radiometers, transmitters and transceivers, on-chip calibration and compensation techniques
G25 Microwave Photonic Circuits and Systems (*): Including indium phosphide and silicon nitride based photonic integrated circuits

(*) common topic with EuMC

Conference Highlights

Over 100 papers and poster papers will be presented with contributions from Europe, Asia, Middle East, USA, and a growing number of emerging countries. High-quality papers and posters will be accepted after a rigorous review process and made available in the Conference Proceedings. Lively industrial panel sessions will also be organised. Keynote speakers from industry and academia will present invited talks on hot topics. Tailored short courses and workshops will complement the programme.

EuMIC Microwave Prize

The EuMIC Technical Programme Committee and the EuMW Steering Committee will award the EuMIC 2019 Prize of €3,000 to the author(s) of the best contributed paper to EuMIC 2019. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

EuMIC Young Engineers Prizes

The EuMIC Technical Programme Committee and the EuMW Steering Committee will award a EuMIC Young Engineer Prize of €2,000 to young engineers or researchers who have presented an outstanding paper at the European Microwave Integrated Circuits Conference. To be eligible, candidates must be (1) under 30 years of age at date of award, (2) the first author of the paper, and (3) the contribution presented in an oral or a poster session. The first author must have made a major contribution in the work reported, which must be described in an electronic statement signed by all co-authors of the paper (effectively co-authors state that their contribution was merely advisory). This statement has to include the date of birth of the first author and must be submitted together with the original submission. The number of co-authors of the paper is not limited. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.

GAAS® PhD Student Fellowship

The GAAS® Association sponsors three student fellowships of € 2,000 each, to be given to young full-time PhD students each having an accepted paper at EuMIC 2018. The purpose is to recognize and provide financial assistance to international PhD students who show promise and interest in pursuing a graduate degree in microwave electronics. Applications should be submitted before 1st June 2019 to the EuMW General Chair. For further details see the GAAS® Association website at www.gaas-symposium.eu.

Reduced Fees and Special Grants

Reduced registration fees are offered for students as well as senior persons aged 65 years or more. The European Microwave Association will also provide up to six student grants of €750 and free EuMIC registration. Applicants for a student grant must be aged 30 or younger at the time of the European Microwave Week, be a full-time student, i.e., an undergraduate or a PhD student, and they will be asked to provide a supervisor’s written confirmation of their current student status. The European Microwave Association will also provide a number of grants for delegates coming from the Newly Independent States, from Russia, and from low-income countries. The value of the grant is €750 in addition to a free EuMIC registration. Applications should be sent to the EuMW General Chairman by 1st June 2019. 

14th EuMIC Team

Chair: 
Farid Medjdoub
IEMN-CNRS
farid.medjdoub@iemn.univ-lille1.fr

Co-Chair:
Hervé Blanck
United Monolithic Semiconductors GmbH
herve.blanck@ums-ulm.de

TPC Chair:
Jean Christophe Nallatamby
XLIM-Université de Limoges
jean-christophe.nallatamby@unilim.fr

TPC Co-Chair:
Joaquín Portilla
University of the Basque Country, UPV/EHU
oaquin.portilla@ehu.es

 

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About EuMA

The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, education, training and research activities. [more]

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