EuMIC Plenary Session Details

Opening

Jacques C. Rudell, Professor, University of Washington

“Integrated Self-Interference Mitigation in Modern Intelligent Systems”

Abstract

With the evolution of increasingly higher levels of integration in modern SoCs, combined with the insatiable demand for more data/information across a channel, the challenges of self-interference are appearing in a plethora of diverse applications from wireless and wireline transceivers, to biomedical systems (neural interfaces, imaging front-ends, etc) and quantum electronics. Increased spectral efficiency motivates the use of radios that simultaneously transmit and receive using the same frequency band – this is commonly referred to as in-band full duplex (FD) communication. The strong transmitter self-interference in FD radios places extreme performance demands on the corresponding receiver with respect to linearity, noise figure degradation, reciprocal mixing, and as high a cancellation depth and bandwidth as possible. Moreover, while there have been several successful research efforts that demonstrate the feasibility of integrated self-interference cancellation techniques, these solutions require a high degree of tunability using complex and lengthy calibration algorithms, which further challenge the practical use of RF radios for commercial wireless systems.

This presentation will review the challenges surrounding self-interference in a diverse set of applications from biomedical to wireless communication and radar sensing. It is followed by a survey of the last eight years of our laboratory research on integrated radio front-ends for FD wireless systems. Our more recent work on the use of convolutional neural networks (CNNs) for rapid adaptation of a full-duplex canceller will be highlighted toward the end of the presentation along with our thoughts for future research on highly adaptable integrated radio front-ends.

Jacques “Chris”tophe Rudell received degrees in electrical engineering from the University of Michigan (BS), and UC Berkeley (MS, PhD). After finishing his PhD, he worked as an RF IC designer at Berkana Wireless (now Qualcomm), and Intel Corporation. In January 2009, he joined the faculty at the University of Washington, Seattle, where he is now a Professor of Electrical and Computer Engineering. He is also a member of the Center for Neural Technology (CNT) and serves as the co-director of the Center for the Design of Analog-Digital Integrated Circuits (CDADIC).

While a PhD student at UC Berkeley, Dr. Rudell received the Demetri Angelakos Memorial Achievement Award, a citation given to one student per year by the EECS department. He has twice been co-recipient of the best paper awards at the IEEE International Solid-State Circuits Conference (ISSCC), the first of which was the 1998 Jack Kilby Award, followed by the 2001 Lewis Winner Award. He received the 2008 ISSCC best evening session award, and best student paper awards at the 2022 IEEE European Solid-State Circuits Conference (ESSCiRC), and at the IEEE Radio Frequency Integrated Circuit (RFIC) Symposium in 2011 and 2015. Dr. Rudell is the recipient of the National Science Foundation (NSF) CAREER Award. He was a technical program committee reviewer for ISSCC (2003-2010), recently rejoining the committee for the 2025 conference. He served on the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium steering committee (2002-2013), where he was the 2013 General Chair, in addition to sitting on the technical program committee of the IEEE Custom Integrated Circuits Conference (2018-2024). He has been an Associate Editor for the IEEE Journal of Solid-State Circuits (2009-2015). At present, he serves on the technical program committees of ESSCirC (2018 – present) and ISSCC (2025- present).

Andreia Cathelin, Technical Director Advanced R&D Design and Technology R&D Fellow, STMicroelectronics, Crolles, France

“FD-SOI : GAME CHANGER IN THE IOT ARENA”

Our circuits change the world!

Abstract

This talk will bring the distinguished audience into the IoT land, presenting first the application fields, and then the integration challenges. We will then discuss about the FD-SOI CMOS technologies, and how their particular features permit to tend towards the best-in-class energy efficiency and life time for such products, thanks to this technology opportunity. Sustainability aspects and implications will as well be discussed. We will demonstrate that technologists and IC designers can and should contribute to an overall carbon neutrality aspect over three axes: enable technologies that are energy-aware by construction, act for a system level global energy aware strategy and bring in circuit design solutions that always show 10x better energy reduction.

Andreia Cathelin (M’04, SM’11) started electrical engineering studies at the Polytechnic Institute of Bucarest, Romania and graduated with MS from the Institut Supérieur d’Electronique du Nord (ISEN), Lille, France in 1994. In 1998 and 2013 respectively, she received PhD and “habilitation à diriger des recherches” (French highest academic degree) from the Université de Lille 1, France.

Since 1998, she has been with STMicroelectronics, Crolles, France, now Advanced R&D Design Technical Director and Technology R&D Fellow. Her focus areas are in the design of RF/mmW/THz and ultra-low-power circuits and systems. She is currently leading the RF Affinity team transversal inside the company, which enables knowledge creation and breakthrough solutions in the field towards open innovation and business impact.

Andreia is very active in the IEEE community since more than 15 years, strongly implied with SSCS and its Adcom (2 terms up to 2022). She is a member of the VLSI Symposium Executive Committee and has been the TPC chair of ESSCIRC 2020 and 2021 in Grenoble, and General Co-Chair of ESSCIRC-ESSDERC 2023 in Lisbon. She is as well IEEE RFIC Symposium TPC member and has been for 10 years involved with ISSCC as RF subcommittee chair and then member of the Executive Committee. She is as well an active founding member of the IEEE SSCS Women in Circuits group.

Andreia has authored or co-authored 150+ technical papers and 14 book chapters, has co-edited the Springer book “The Fourth Terminal, Benefits of Body-Biasing Techniques for FDSOI Circuits and Systems” and has filed more than 40 patents. She is currently Associate Editor for T-MTT, TCAS-I and OJ-SSCS IEEE journals.

Andreia has been a recipient and co-recipient of several awards with ISSCC and RFIC. She is as well the winner of the 2012 STMicroelectronics Technology Council Innovation Prize, and has been awarded an Honorary Doctorate from the University of Lund, Sweden, promotion of 2020.

Closing

Valeria Di Giacomo Brunel, United Monolithic Semiconductors (UMS)

“New horizons for efficient RF front-end technologies and integration”

Abstract

The increasing demands of wireless communication systems, IoT devices, and emerging technologies like 5G are driving the technology developments towards more and more efficient and integrated systems.

Integration of multiple RF functions onto a single chip or within a single package helps reducing the overall footprint, cost, and power consumption of RF front-ends while enhancing performance and simplifying design. This integration needs advanced semiconductors technologies like Gallium Nitride (GaN) and Silicon Germanium (SiGe), but also innovative Packaging techniques, such as Top-side cooling, System-in-Package (SiP) and Wafer-Level Packaging (WLP), in order to reduce parasitics, improve thermal management, and enhance overall system reliability.

In this talk, the enabling factors for efficient and highly integrated RF front-end will be reviewed and a landscape of state-of-the-art front-end and packaging technologies will be provided, together with the most interesting perspectives for the next future.

Valeria Di Giacomo Brunel is at the head of Foundry Services in UMS (United Monolithic Semiconductors). She joined UMS in 2011 as modelling engineer and she covered later the position of project manager for technology development.

Valeria did her studies at University of Bologna and at University of Ferrara, Italy, where she got her PhD in Electronics in 2009. Prior to join UMS, she covered the position of post-Doc researcher at University of Bologna and at IEMN in Lille, France, dedicating her research activities to nonlinear modelling and characterization of microwave devices.