European Microwave Integrated Circuits Conference 2017
8th – 10th October 2017
The 12th European Microwave Integrated Circuits Conference (EuMIC) will be held in Nuremberg, Germany, as part of the European Microwave Week 2017. Initiated by the GAAS Association in 1990 and renamed in 2006, the conference returns to Nuremberg in 2017.
The EuMIC conference is jointly organised by the GAAS Association and EuMA and is the premier European technical conference for RF, microwave and Terahertz microelectronics. It has established itself as a key contributor to the success of the overall European Microwave Week and remains the largest scientific event in Europe related to microwave integrated circuits.
The aim of the conference is to promote the discussion of recent developments and trends, and to encourage the exchange of scientific and technical information covering a broad range of high-frequency related topics, from materials and technologies to integrated circuits and applications; encompassing all relevant aspects such as theory, simulation, design, and measurement. Research and innovation in this field helps to create the crucial enabling infrastructure for new and emerging information and communication applications, such as 5G communications and the Internet-of-Things.
Technological innovations continue to drive challenges for modelling and simulation as well as for the characterisation techniques applied at both device and circuit levels. While GaAs and silicon-based IC technologies are extensively used in today’s systems, emerging technologies such as wide-bandgap (SiC, GaN, etc.), CNT, and graphene-based devices are expected to become commercially available within the coming years, with a huge expected impact on system performance. Moreover, new materials and devices push integrated circuit capability to millimetre-wave and even to THz bands, while high-speed digital and optoelectronic integrated circuits represent other key areas of interest.
In the modelling area, topics related to device and system small- and large-signal characterisation, test set-ups, and modelling approaches up to the THz band are of interest. In the technology area, papers on nanotechnologies for microwaves, as well as wide-bandgap devices and technologies for microwave photonics are specifically solicited. Topics related to semiconductor devices, IC reliability and 3D-interconnects in ICs are also invited to the conference. Finally, contributions are encouraged in the areas of circuit design and applications, RF and microwave ICs, millimetre and sub-millimetre wave ICs, photonic ICs, mixed-signal and high-speed digital ICs, tunable and reconfigurable ICs as well as integrated detectors, receivers, transmitters, and transceivers.
If you are interested in the subject of microwave and RF microelectronic devices and ICs, the EuMIC conference is an exceptional high-quality event to learn about the latest advances in the field and to meet internationally recognized experts from both industry and academia.
Modelling, Simulation and Characterisation of Devices and Circuits
G1 Physics Based Device Modelling and Simulation: Physical device and structure modelling including but not limited to active and passive, linear and non-linear simulation, characterisation, parameter extraction and model validation techniques
G2 TCAD Device Modelling and Simulation: Circuit and statistics-based modelling including but not limited to simulation, modelling, and design optimisation, surrogate modelling and model-order reduction techniques
G3 Small Signal, Large Signal and Noise Modelling: Empirical and behavioral device and structure modelling including but not limited to active and passive, linear and nonlinear characterisation, parameter extraction and model validation techniques
G4 Linear and Nonlinear Characterisation Techniques: Theoretically supported and experimentally demonstrated measurement techniques for devices and materials including but not limited to linear and nonlinear, time and frequency domain characterisation, error correction, de-embedding and calibration
G5 Linear and Nonlinear CAD Techniques for Devices and Circuits: Computer-aided design including but not limited to design automation, finite-difference, finite-element, integral equation, hybrid and other simulation methods for RF, microwave and terahertz devices and circuits, distortion, stability and qualitative dynamics analysis
G6 Multi-Physics Device and IC Modelling and Simulation (Thermal, EM, Transport): Simulation, modelling, and design optimisation techniques for devices and integrated circuits including but not limited to EM-, thermal, transport and multi-physics-based analysis
Technologies, Devices and IC-Processes
G7 Nanomaterials, Technologies and Devices for Microwave and Terahertz Applications: New and emerging material and device concepts including but not limited to carbon nanotubes, nanowires, nanoparticles, other nano-object based devices and systems, 1D-2D material based electronics, metamaterials, graphene, diamond, organic carbon based devices and technologies
G8 Device and IC Manufacturing: Reliability, Processes and Testing: MMIC technologies and processes including but not limited to manufacturing, reliability, failure analysis, testing, yield and cost
G9 Passive Devices, Hetero-Integration and 3D-Interconnects in ICs: Wafer-level integration techniques and More-than-Moore IC technologies including but not limited to III-V on Si and microwave MEMS integration, substrate-integrated and Si micro-machined waveguides and components, 3D-interconnects, wafer-level stacking and bonding, interconnect between heterogeneous materials, and technologies with integrated cooling. Planar and non-planar integrated transmission lines, waveguides, couplers, dividers/combiners, tunable devices.
G10 Si-Based Microwave Devices: Monolithic integrated electronic devices based on Si-based semiconductor technologies including but not limited to RF, microwave, and millimetre-wave active and passive devices in Si (C)MOS, SiGe BiCMOS and others
G11 GaN and Other Wide-Bandgap Semiconductor Devices: Monolithic integrated electronic devices based on wide-bandgap-based semiconductors including but not limited to RF, microwave, and millimetre-wave active and passive devices in GaN, SiC, diamond and others.
G12 III-V Compound Semiconductor Devices: Monolithic integrated electronic devices based on III-V compound semiconductor technologies including but not limited to RF, microwave, and millimetre-wave active and passive devices in GaAs, InP and other compound semiconductors
G13 Devices for Terahertz Electronics and Integrated Microwave Photonics: Novel electronic, photonic and opto-electronic devices for millimetre-wave and Terahertz operation including but not limited to tunnel-FETs, resonant tunneling diodes, uni-traveling carrier photo diodes, mixers and other nonlinear photonic devices, and Silicon Photonics
Circuit Design and Applications
G14 RF and Microwave Integrated Circuits: Linear and non-linear MMICs with upper cutoff frequencies up to 30 GHz including but not limited to signal amplification, generation, modulation, frequency conversion, phase and amplitude control
G15 Millimetre-Wave and Sub-Millimetre-Wave Integrated Circuits: Linear and non-linear MMICs with upper cutoff frequencies beyond 30 GHz including but not limited to signal amplification, generation, modulation, frequency conversion, phase and amplitude control
G16 Mixed-Signal and High-Speed Digital ICs: Mixed-signal circuits including but not limited to high-speed ADC, DAC and DDS for transmission and electrical/optical interfaces, backplanes, MIMO, SDR and cognitive system-on-chip, considering signal integrity, equalisation and other performance criteria
G17 Ultra Low-Power ICs: Low power consumption microwave and millimetre-wave integrated circuits including but not limited to signal amplification, generation, modulation, frequency conversion, phase and amplitude control; wake-up transceivers; antimonide and other low power semiconductor-based microwave and millimetre-wave integrated circuits
G18 Power Amplifier ICs: Solid-state power amplifiers for RF, microwave, and millimetre-wave signals including but not limited to wide-bandgap, compound semiconductor and silicon-based microwave power amplifiers; switch-mode amplifiers
G19(*) Power Amplifiers and Smart Transmitters: Efficiency Enhancement, Linearisation, Hybrid Integration: Cartesian and polar power amplifier design, behavioral modelling, continuous and switch-mode operation, linearisation and predistortion techniques, efficiency enhancement, adaptive gain control, power combining, matching and packaging, amplitude and phase characterisation
G20(*) Tunable and Reconfigurable Circuits and Systems: Electronic, magnetic, mechanic, thermal tuning approaches, switches and switching devices, tunable, reconfi gurable or programmable devices, performance metrics and evaluation
G21 Integrated Detectors, Receivers, Transmitters and Transceivers: Monolithic integrated transceiver circuits including but not limited to homodyne, heterodyne, direct-detection, coherent and incoherent receivers, detectors and radiometers, transmitters and transceivers
G22(*) System-in-Package Technologies from RF to Terahertz and Photonics: Dielectric and substrate materials, LTCC, LCP and MCM technologies, component and subsystem packaging, assembly methods, 3D-printing, wafer stacking, 3D-interconnects
(*) common topic with EuMIC
Over 100 papers and poster papers will be presented with contributions from Europe, Asia, Middle East, USA, and a growing number of emerging countries. High-quality papers and posters will be accepted after a rigorous review process and made available in the Conference Proceedings. Lively industrial panel sessions will also be organised. Keynote speakers from industry and academia will present invited talks on hot topics. Tailored short courses and workshops will complement the programme.
EuMIC Microwave Prize
The EuMIC Technical Programme Committee and the EuMW Steering Committee will award the EuMIC 2017 Prize of € 3,000 to the author(s) of the best contributed paper to EuMIC 2017. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.
EuMIC Young Engineers Prizes
The EuMIC Technical Programme Committee and the EuMW Steering Committee will award a EuMIC Young Engineer Prize of € 2,000 to young engineers or researchers who have presented an outstanding paper at the European Microwave Integrated Circuits Conference. To be eligible, candidates must be (1) under 30 years of age at date of award, (2) the first author of the paper, and (3) the contribution presenter in an oral or a poster session. The first author must have a major contribution in the work reported, which must be described in an electronic statement signed by all co-authors of the paper (effectively co-authors state that their contribution was merely advisory). This statement has to include the date of birth of the first author and must be submitted together with the original submission. The number of co-authors of the paper is not limited. An extended version of the winning paper will be considered for publication in the International Journal of Microwave and Wireless Technologies.
GAAS® PhD Student Fellowship
The GAAS® Association sponsors three student fellowships of € 2,000 each, to be given to young full-time PhD students each having an accepted paper at EuMIC 2017. The purpose is to recognize and provide financial assistance to international PhD students who show promise and interest in pursuing a graduate degree in microwave electronics. Applications should be submitted before May 26th 2017 to the EuMW General Chairman. For further details see the GAAS® Association website at www.gaas-symposium.eu.
Reduced Fees and Special Grants
Reduced registration fees are offered for students as well as senior persons aged 65 years or more. The European Microwave Association will also provide up to six student grants of € 500 and free EuMIC registration. Applicants for a student grant must be aged 30 or younger at the time of the European Microwave Week, be a full-time student, i.e., an undergraduate or a PhD student, and they will be asked to provide a supervisor’s written confirmation of their current student status. The European Microwave Association will also provide a number of grants for delegates coming from the Newly Independent States, from Russia, and from low income countries. The value of the grant is € 500 in addition to a free EuMIC registration. Applications should be sent to the EuMW General Chairman by 26th May 2017.
12th EuMIC Team
University of Stuttgart
Berlin Institute of Technology
Berlin Institute of Technology
The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, education, training and research activities. [more]
- A link to the plan of the exhibition layout
- Download the call for papers in pdf format
- Exhibitor application for EuMW 2016
News and Press
- Submit Summaries Online! Deadline 13th February 2017